What material is commonly used for constructing heatsinks for effective thermal conduction?

The choice of aluminum and copper alloy for constructing heatsinks is based on their excellent thermal conductivity properties. Both materials are capable of efficiently transferring heat away from components such as CPUs and GPUs, which is essential for maintaining optimal operating temperatures and preventing overheating.

Aluminum is lightweight, cost-effective, and possesses good thermal conductivity, making it a popular choice for many electronic applications. Its ease of manufacturing also allows for intricate designs that can enhance airflow and cooling efficiency. Copper, on the other hand, has even higher thermal conductivity than aluminum, which is why it is often used in high-performance cooling solutions. When combined, these two materials can deliver effective thermal management in a variety of devices.

The other materials listed in the options, like plastic and rubber, are poor conductors of heat and are generally not suitable for use in heatsinks. Steel has decent strength but is heavier and less thermally effective than aluminum and copper. Glass is not a conductive material at all, making it unsuitable for heatsinking applications. Carbon and silicone, while having unique properties, do not provide the desired thermal conduction needed for effective heat dissipation in electronic devices.